Hybrid Cleaning

Plasma cleaning of thin film and thick film hybrid circuits with Argon is a safe and effective way to remove epoxy bleed out, baked photoresist, solder flux, or other organic contaminants.

Plasma cleaning improves wire bond strength and will increase yield and throughput. In fact, documented test have shown up to a 70% decrease in wire bond failures after plasma cleaning. A five to ten minute cycle is generally sufficient.