MARCH CS-1701

 MARCH CS-1701 RIE System

The MARCH CS-1701 system is still supported by Nordson MARCH and Glow Research has rebuilt this system to the highest standards.  After sale support can be contracted with Nordson MARCH world-wide.   Installation assistance is supported by Glow Research.

This newer style MARCH CS-1701 has updated gas manifold with a lid lift assist option. The MARCH CS-1701 Reactive Ion Etch (RIE) system delivers high end metal etching, silicide etching and etching of III-V compounds, anisotropic etching of oxides, nitrates and polyimide’s.

Holds a 4″, 6″ or 8″ wafer, 0-600 watts, Automatic tuning, Automatic optical endpoint detection.

Key performance features of the CS 1701 system include the large DC bias and the ability to control process pressure independent of gas flow. The system allows users a wide variety of etch profiles ranging from anisotropic requiring high aspect ratios to sloped walls.

System has 2 process gases (via MFC’s) and a N2 purge. The top-loading chamber is designed to ensure anisotropic etching and maximize selectivity, uniformity, and speed.

  • The chamber is a two piece clam-shell type and the material to be etched is placed on a powered electrode mounted in the center of the base of the chamber.
  • The size ratio of the small powered electrode to the larger ground electrode produces a negative DC bias which enhances ion bombardment and anisotropy.
  • A ring focuses the plasma on the bottom electrode, thus optimizing power utilization.
  • The bottom electrode is water cooled to maintain the sample at a low temperature during processing.
  • The chamber is equipped with a circular quartz viewing window for observation of the plasma process.
  • The primary chamber material is anodized aluminum.