Tegal 903e

Cassette-to-Cassette In-line Single Wafer Plasma Etcher. Capability to etch vias and contacts. For etching silicon dioxide, silicon nitrides, and polyamides. System is sold with consultation from on proper facilitation and operation. System is operational and can be demonstrated at our Customer Support Center in Mesa, Arizona. Various upgrades are available to fit your specific needs.

Can handle wafers from 3 in. to 6 in. Currently configured for 4 in. wafers.

• Microprocessor control
• Currently configured for 4 in. (100mm) wafers.
• ENI 1,000 Watt 13.56 MHz RF Generator.
• 20 Process recipe capability
• Process gases controlled by Tylan MFC’s
• Non-friction spatula pick and place wafer transport.
• Leybold D65 oxygen service pump (optional dry pump available)
• Two Tegal closed loop temperature controllers
• DEC Monitor and keyboard
• Non-friction spatula pick and place wafer transport.
• Manuals included, 208 V, 50/60 Hz

(sale pending)