SputterGlow Brochure
SputterGlow Sputter Deposition System
OptiGlow Plasma System
Priced under $10,500 (USD), the sturdy, table-top OptiGlow plasma system is perfect for production or lab applications. Find out more.AutoGlow Plasma System
The AutoGlow plasma system is the most efficient tabletop plasma system of its kind on the market because of its variable 10-300 watt, 13.56 MHz solid state generator. Find out more.Testing and Samples
Glow Research will run samples on a contract basis or for clients interested in the eventual purchase of a new or rebuilt system. Contact us for more information.Contact Us
Address:
12014 S. 35th Ct.
Phoenix, Az. 85044
United StatesPhone:
480-621-8405Translator
Translator
SputterGlow Sputter Deposition System
System for Thin Film, Sputter, PVD, Thin Film Deposition, Vacuum Coating, Metallic or Dielectric Thin Film Deposition.
The Glow Research SputterGlow is a flexible sputter deposition system designed to process 200mm wafers, 156mm x 156mm solar cells or smaller wafers–including pieces of wafers. The SputterGlow can have up to three interchangeable process stations (each station can be configured for heating, sputter deposition or sputter etching). The SputterGlow was originally designed to deposit Si3N4 antireflective coatings on photovoltaic cells.
Photovoltaic researchers have found the SputterGlow to be an excellent alternative to Plasma Enhanced Chemical Vapor Deposition (PECVD) for this application because the SputterGlow process does not require Silane (SiH4) for nitride deposition.
Along with the tremendous cost savings–of not requiring expensive facilitation or safety hurdles–many researchers feel there are strong advantages to using a sputtered film for the final passivation/anti-reflective coating, resulting in a higher efficiency photovoltaic cell. The SputterGlow was designed by John Reche. For a background on John Reche please click on “About Us” on this web site.
Flexibility
With three chamber stations, the SputterGlow can be used for a variety of processing needs. The individual stations can be interchangeably used for heating, sputtering or etching with proper choice of options at purchase, or retrofitted at a later date. The SputterGlow is a perfect choice for research or low volume manufacturing applications.
Chamber Integrity/cost
Vacuum Testing
The SputterGlow was designed to ensure process vacuum integrity and utilize an aluminum chamber (to keep cost down). The chamber has been helium leak tested to 6.5 x 10-10 mbar with all ports blocked, (4.8 x 10-10 torr).
The custom designed aluminum chamber allows for a 3X price reduction when compared to a stainless steel chamber of the same caliber. The SputterGlow can operate from an extremely low power of 25 watts (for less aggressive processing), to 1 kW for more aggressive sputter deposition.
The custom designed aluminum chamber allows for a 3X price reduction when compared to a stainless steel chamber of the same caliber. Chamber is 34” in diameter x 11” tall.
Proprietary Design
A proprietary planar magnetron is used to generate the plasma. This design results in a longer lifetime for the sputtering target, and improved deposition uniformity on the substrate. The Glow Research proprietary planar magnetron will also enhanced sputtering rates and lower heat transfer to the substrate.
PC Computer Control
Manual or Lap-Top Computer Control
An embedded microprocessor controls the motors of the wafer transport system, position of the wafer pedestals, opening of the vacuum and gas valves, etc. The user controls the deposition process by downloading a recipe from their personal laptop (not supplied). The embedded microprocessor is connected to the laptop via a USB port. The user can tailor their own process with the Glow Research proprietary sequencing program, or select any preset process that has been downloaded to their computer.
Power Supplies
The SputterGlow can be configured with RF, DC or pulsed DC power supplies. The SputterGlow can be used to deposit a variety of materials…dielectrics, semiconductors, metals and magnetic materials. Pulsed DC can be used instead of an RF supply with the advantage of eliminating the tuning network. A DC supply can specified if metals or magnetic materials are to be sputtered exclusively.